The thermal insulation effect of ceramic fiber board is mainly reflected in its thermal conductivity. Thermal conductivity is one of the most important thermal and moisture physical parameters of thermal insulation materials. It refers to a material with a thickness of 1m under stable heat transfer conditions. The temperature difference between the two sides is 1 degree (K, ℃). The heat transferred by a square meter area, in watts/meter·degree (W/(m·K)).
Thermal insulation materials usually refer to materials with low thermal conductivity (Chinese national standards stipulate that materials with thermal conductivity not greater than 0.12W/(m·K) at an average temperature of 350℃ are called thermal insulation materials). Materials with a coefficient below 0.05 W/(m·K) are called high-efficiency insulation materials.
According to testing, the thermal conductivity of ceramic fiber board is 0.065-0.085 at 200°C; 0.095-0.112 at 400°C; and 0.145-0.165 at 600°C.
As a typical thermal insulation material, ceramic fiber board has low thermal conductivity and low heat capacity, good thermal shock resistance, wind erosion resistance, and micro-elasticity. It is a product with high application rate of industrial kiln backing insulation.
